Datasheet

AD5663
Rev. 0 | Page 21 of 24
OUTLINE DIMENSIONS
3.00
BSC SQ
INDEX
AREA
TOP VIEW
1.50
BCS SQ
EXPOSED
PAD
(BOTTOM VIEW)
1.74
1.64
1.49
2.48
2.38
2.23
1
6
10
0.50
BSC
0.50
0.40
0.30
5
PIN 1
INDICATOR
0.80
0.75
0.70
0.05 MAX
0.02 NOM
S
EATING
PLANE
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.55 TYP
SIDE VIEW
Figure 39. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm x 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-BA
0.23
0.08
0.80
0.60
0.40
8°
0°
0.15
0.05
0.33
0.17
0.95
0.85
0.75
SEATING
PLANE
1.10 MAX
10
6
5
1
0.50 BSC
PIN 1
COPLANARITY
0.10
3.10
3.00
2.90
3.10
3.00
2.90
5.15
4.90
4.65
Figure 40. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature
Range
Power-On
Reset Code
Accuracy
Package
Description
Package
Option
Branding
AD5663ARMZ
1
−40°C to +105°C Zero ±16 LSB INL 10-lead MSOP RM-10 D80
AD5663ARMZ-REEL7
1
−40°C to +105°C Zero ±16 LSB INL 10-lead MSOP RM-10 D80
AD5663BRMZ
1
−40°C to +105°C Zero ±12 LSB INL 10-lead MSOP RM-10 D8C
AD5663BRMZ-REEL7
1
−40°C to +105°C Zero ±12 LSB INL 10-lead MSOP RM-10 D8C
AD5663BRMZ-1
1
−40°C to +105°C Midscale ±12 LSB INL 10-lead MSOP RM-10 D7J
AD5663BRMZ-1REEL7
1
−40°C to +105°C Midscale ±12 LSB INL 10-lead MSOP RM-10 D7J
AD5663BCPZ-250RL7
1
−40°C to +105°C Zero ±12 LSB INL 10-lead LFCSP_WD CP-10-9 D8C
AD5663BCPZ-REEL7
1
−40°C to +105°C Zero ±12 LSB INL 10-lead LFCSP_WD CP-10-9 D8C
1
Z = Pb-free part.