Datasheet
Data Sheet AD5628/AD5648/AD5668
Rev. J | Page 9 of 30
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 5.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
Digital Input Voltage to GND −0.3 V to V
DD
+ 0.3 V
V
OUT
to GND −0.3 V to V
DD
+ 0.3 V
V
REFIN
/V
REFOUT
to GND −0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
J
MAX
) 150°C
Reflow Soldering Peak Temperature
Pb Free 260°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
RU-14
1
121 35 °C/W
RU-16
1
113.5 35 °C/W
CP-16-17
2
50.6 30 °C/W
CB-16-16
1
45 °C/W
1
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board. See JEDEC JESD51.
2
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board with nine thermal vias. See JEDEC JESD51.
ESD CAUTION
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