Datasheet

AD5626
Rev. A | Page 17 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
8°
0°
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 36. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
062507-A
TOP VIEW
8
1
5
4
0.30
0.23
0.18
EXPOSED
PAD
(BOTTOM VIEW)
PIN 1 INDEX
AREA
3.00
BSC SQ
SEATING
PLANE
0.80
0.75
0.70
0.20 REF
0.05 MAX
0.02 NOM
0.80 MAX
0.55 NOM
1.74
1.64
1.49
2.48
2.38
2.23
0.50
0.40
0.30
0.65 BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
9
)
Figure 37. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm x 3 mm Body, Very Very Thin, Dual Lead
(CP-8-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model INL (LSB) Temperature Range Package Description Package Option Branding
AD5626BRMZ
1
±1 –40°C to +85°C 8-Lead MSOP RM-8 DAP
AD5626BRMZ-REEL7
1
±1 –40°C to +85°C 8-Lead MSOP RM-8 DAP
AD5626BCPZ-REEL7
1
±1 –40°C to +85°C 8-Lead LFCSP_WD CP-8-3 DAP
1
Z = RoHS Compliant Part.