Datasheet

AD5590
Rev. A | Page 42 of 44
OUTLINE DIMENSIONS
*
COMPLIANT TO JEDEC STANDARDS MO-205-AC
WITH THE EXCEPTION TO BALL DIAMETER.
011007-A
SEATING
PLANE
0.35 NOM
0.30 MIN
DETAIL A
*
0.50
0.45
0.40
BALL DIAMETER
0.12 MAX
COPLANARITY
0.80 BSC
8.80
BSC SQ
A1 CORNER
INDEX AREA
TOP VIEW
BOTTOM
VIEW
10.00
BSC SQ
BALL A1
PAD CORNER
DETAIL A
2.50 SQ
1.50
1.36
1.21
1.11
1.01
0.91
0.65 REF
0.36 REF
1
A
B
C
D
E
F
G
H
J
K
L
M
2
3
4
56
7
8910
1112
0.60 REF
Figure 74. 80-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-80-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD5590BBC −40°C to +85°C 80-Ball CSP_BGA BC-80-2
AD5590BBCZ −40°C to +85°C 80-Ball CSP_BGA BC-80-2
EVAL-AD5590EBZ
Evaluation Board
1
Z = RoHS Compliant Part.