Datasheet

AD5590
Rev. A | Page 11 of 44
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C unless otherwise noted. V
DD
refers to DACV
DD
or
ADCV
DD
. GND refers to DACGND or ADCGND.
Table 7.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
V
DRIVE
to GND −0.3 V to V
DD
+ 0.3 V
Op Amp Supply Voltage 6 V
Op Amp Input Voltage (V1− or V2−) − 0.3 V to
(V1+ or V2+) + 0.3 V
Op Amp Differential Input Voltage
±6 V
Op Amp Output Short-Circuit
Duration to GND
Indefinite
Analog Input Voltage to GND −0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to GND −0.3 V to +7 V
Digital Output Voltage to GND −0.3 V to V
DD
+0.3 V
V
REFA
to GND
−0.3 V to V
DD
+0.3 V
V
REFIN
/V
REFOUT
to GND −0.3 V to V
DD
+0.3 V
Input Current to Any ADC Pin
Except Supplies
±10 mA
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
J
max) 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a 4-layer JEDEC thermal test board for surface-
mount packages.
Table 8. Thermal Resistance
Package Type
θ
JA
Unit
80-Ball CSP_BGA 40 °C/W
Table 9. Junction Temperature
Parameter Max Unit Comments
Junction Temperature
1, 2
130
°C
T
J
= T
A
+ P
TOTAL
× θ
JA
1
P
TOTAL
is the sum of ADC, DAC, and operational amplifier supply currents.
2
θ
JA
is the package thermal resistance.
ESD CAUTION