Datasheet
AD558
REV. A
–3–
ABSOLUTE MAXIMUM RATINGS*
V
CC
to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V
Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V
V
OUT
. . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground
Momentary Short to V
CC
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Storage Temperature Range
N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25°C to +100°C
D (Ceramic) Package . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300°C
Thermal Resistance
Junction to Ambient/Junction to Case
D (Ceramic) Package . . . . . . . . . . . . . . 100°C/W/30°C/W
N/P (Plastic) Packages . . . . . . . . . . . . . 140°C/W/55°C/W
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
AD558 METALIZATION PHOTOGRAPH
Dimensions shown in inches and (mm).
Figure 1a. AD558 Pin Configuration (DIP)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
AD558
TOP VIEW
(Not to Scale)
V
OUT
V
OUT
SENSE
V
OUT
SELECT
GND
GND
+V
CC
CS
(LSB) DB0
DB1
DB2
DB3
DB4
DB5
DB6
(MSB) DB7
CE
Figure 1a. AD558 Pin Configuration (DIP)
AD558
TOP VIEW
(Not to Scale)
1
2
3
20 19
9
10 11 12 13
4
5
7
6
8
18
17
16
15
14
V
OUT
SELECT
GND
NC
GND
+V
CC
DB2
DB3
DB4
DB5
NC
DB1
DB0 (LSB)
NC
V
OUT
V
OUT
SENSE
DB6
(MSB) DB7
NC
CE
CS
NC = NO CONNECT
Figure 1b. AD558 Pin Configuration (PLCC and LCC)
ORDERING GUIDE
Relative Accuracy Full-Scale
Error Max Error, Max Package
Model
1
Temperature T
MIN
to T
MAX
T
MIN
to T
MAX
Option
2
AD558JN 0°C to +70°C ±1/2 LSB ±2.5 LSB Plastic (N-16)
AD558JP 0°C to +70°C ±1/2 LSB ±2.5 LSB PLCC (P-20A)
AD558JD 0°C to +70°C ±1/2 LSB ±2.5 LSB TO-116 (D-16)
AD558KN 0°C to +70°C ±1/4 LSB ±1 LSB Plastic (N-16)
AD558KP 0°C to +70°C ±1/4 LSB ±1 LSB PLCC (P-20A)
AD558KD 0°C to +70°C ±1/4 LSB ±1 LSB TO-116 (D-16)
AD558SD –55°C to +125°C ±3/4 LSB ±2.5 LSB TO-116 (D-16)
AD558TD –55°C to +125°C ±3/8 LSB ±1 LSB TO-116 (D-16)
NOTES
1
For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices
Military Products Databook or current AD558/883B data sheet.
2
D = Ceramic DIP; N = Plastic DIP; P = Plastic Leaded Chip Carrier.