Datasheet

AD5570
Rev. C | Page 8 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
DD
to AGND, AGNDS, DGND −0.3 V to +17 V
V
SS
to AGND, AGNDS, DGND +0.3 V to −17 V
AGND, AGNDS to DGND −0.3 V to +0.3 V
REFGND to AGND, ADNDS −0.3 V to +0.3 V
REFIN to AGND, AGNDS −0.3 V to +17 V
REFIN to REFGND −0.3 V to +17 V
Digital Inputs to DGND −0.3 V to V
DD
+ 0.3 V
V
OUT
to AGND, AGNDS
V
SS
− 0.3 V to
V
DD
+ 0.3 V
SDO to DGND −0.3 V to +6.5 V
Operating Temperature Range
W/Y Grades −40°C to +125°C
A/B Grades −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature (T
J
max) 150°C
16-Lead SSOP Package
Power Dissipation (T
J
max – T
A
)/θ
JA
θ
JA
Thermal Impedance 139°C/W
Lead Temperature (Soldering, 10 sec) 300°C
IR Reflow, Peak Temperature 230°C
ESD
1
5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
1
HBM classification.