Datasheet

Data Sheet AD5545/AD5555
Rev. G | Page 23 of 24
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 34. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
INL
LSB
DNL
LSB
Resolution
(Bits)
Temperature
Range
Package
Description
Package
Option
Ordering
Qty
AD5545BRUZ ±2 ±1 16 −40°C to +85°C 16-Lead TSSOP RU-16 96
AD5545BRUZ-REEL7 ±2 ±1 16 −40°C to +85°C 16-Lead TSSOP RU-16 1000
AD5545CRUZ ±1 ±1 16 −40°C to +85°C 16-Lead TSSOP RU-16 96
AD5545CRUZ-REEL7 ±1 ±1 16 −40°C to +85°C 16-Lead TSSOP RU-16 1000
AD5555CRU ±1 ±1 14 −40°C to +85°C 16-Lead TSSOP RU-16 96
AD5555CRU-REEL7 ±1 ±1 14 −40°C to +85°C 16-Lead TSSOP RU-16 1000
AD5555CRUZ ±1 ±1 14 −40°C to +85°C 16-Lead TSSOP RU-16 96
AD5555CRUZ-REEL7 ±1 ±1 14 −40°C to +85°C 16-Lead TSSOP RU-16 1000
EV-AD5544/45SDZ Evaluation Board
1
The AD5545/AD5555 contain 3131 transistors. The die size measures 71 mil. × 96 mil., 6816 sq. mil.
2
Z = RoHS Compliant Part.