Datasheet

AD5535B Data Sheet
Rev. A | Page 16 of 16
OUTLINE DIMENSIONS
Figure 22. 124-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-124-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Function Output Voltage Span Temperature Range Package Description Package Option
AD5535BKBC 32 DACs 0 V to 200 V maximum −10°C to +85°C 124-Lead CSP_BGA BC-124-2
AD5535BKBCZ 32 DACs 0 V to 200 V maximum −10°C to +85°C 124-Lead CSP_BGA BC-124-2
EVAL-AD5535BEBZ Evaluation Board
1
Z = RoHS Compliant Part.
DETAIL A
BALL DIAMETER
A
B
C
D
E
F
G
J
H
K
L
M
N
P
10
8
7
6
3
2
1
9
5
4
11
1213
14
*
1.25 MAX
0.85 MIN
*
0.41
0.36
0.31
*
0.46 NOM
*
COMPLIANT WITH JEDEC STANDARDS MO-192-AAE-1
WITH EXCEPTION TO DIMENSIONS INDICATED BY AN ASTERISK.
NOMINAL BALL SIZE IS REDUCED FROM 0.60mm TO 0.46mm.
A1 BALL
CORNER
TOP VIEW
DETAIL A
BOTTOM VIEW
SEATING
PLANE
COPLANARITY
0.12
13.00
REF
12-19-2012-A
15.10
15.00 SQ
14.90
BALL A1
PAD CORNER
1.00
BSC
1.70 MAX
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D10852-0-4/13(A)