Datasheet

AD5530/AD5531
Rev. B | Page 18 of 20
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 29. 16-Lead Thin Shrink Small Outline Package (TSSOP)
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Resolution INL (LSBs) DNL (LSBs) Package Description Package Option
AD5530BRU −40°C to +85°C 12 ±1 ±1 16-Lead TSSOP RU-16
AD5530BRU-REEL −40°C to +85°C 12 ±1 ±1 16-Lead TSSOP RU-16
AD5530BRU-REEL7 −40°C to +85°C 12 ±1 ±1 16-Lead TSSOP RU-16
AD5530BRUZ −40°C to +85°C 12 ±1 ±1 16-Lead TSSOP RU-16
1
AD5530BRUZ-REEL −40°C to +85°C 12 ±1 ±1 16-Lead TSSOP RU-16
1
AD5530BRUZ-REEL7 −40°C to +85°C 12 ±1 ±1 16-Lead TSSOP RU-16
1
AD5531BRU −40°C to +85°C 14 ±2 ±1 16-Lead TSSOP RU-16
AD5531BRU-REEL −40°C to +85°C 14 ±2 ±1 16-Lead TSSOP RU-16
AD5531BRU-REEL7 −40°C to +85°C 14 ±2 ±1 16-Lead TSSOP RU-16
AD5531BRUZ −40°C to +85°C 14 ±2 ±1 16-Lead TSSOP RU-16
1
AD5531BRUZ-REEL −40°C to +85°C 14 ±2 ±1 16-Lead TSSOP RU-16
1
AD5531BRUZ-REEL7 −40°C to +85°C 14 ±2 ±1 16-Lead TSSOP RU-16
1
1
Z = Pb-free part.