Datasheet

AD5501 Data Sheet
Rev. C | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 5.
Parameter Rating
V
DD
to AGND
−0.3 V to +64 V
V
LOGIC
to DGND −0.3 V to +7 V
V
OUT
to AGND −0.3 V to V
DD
+ 0.3 V
Digital Input to DGND −0.3 V to V
LOGIC
+ 0.3 V
SDO Output to DGND −0.3 V to V
LOGIC
+ 0.3 V
AGND to DGND
−0.3 V to +0.3 V
Maximum Junction Temperature
(T
J
Maximum)
150°C
Storage Temperature Range −65°C to +150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature Range
20 sec to 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Thermal resistance is for a JEDEC 4-layer (2S2P) printed circuit
board (PCB).
Table 6. Thermal Resistance
Package Type θ
JA
Unit
16-Lead TSSOP 112.60 °C/W
ESD CAUTION