Datasheet

AD5441
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
V
DD
to GND −0.3 V, +8 V
V
REF
to GND ±18 V
R
FB
to GND ±18 V
Logic Inputs to GND −0.3 V, V
DD
+ 0.3 V
I
OUT
to GND −0.3 V, V
DD
+ 0.3 V
I
OUT
Short Circuit to GND 50 mA
Package Power Dissipation (T
J
max − T
A
)/θ
JA
Maximum Junction Temperature (T
J
max) 150°C
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5.
Package Type θ
JA
θ
JC
Unit
8-Lead MSOP 142 44 °C/W
8-Lead LFCSP
1
75 18 °C/W
1
Exposed pad soldered to the ground plane.
ESD CAUTION