Datasheet

AD5441
Rev. A | Page 13 of 16
OUTLINE DIMENSIONS
022808-B
TOP VIEW
8
1
5
4
0.35
0.30
0.25
*
EXPOSED
PAD
(BOTTOM VIEW)
PIN 1 INDEX
AREA
3.00
BSC SQ
SEATING
PLANE
0.80
0.75
0.70
0.20 REF
0.05 MAX
0.02 NOM
0.80 MAX
0.55 NOM
1.74
1.64
1.49
2.48
2.38
2.23
0.50
0.40
0.30
0.65 BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
2
)
*
FOR PROPER CONNECTION OF THE EXPOSED PAD PLEASE REFER TO
THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION
OF THIS DATA SHEET.
Figure 25. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-3)
Dimensions are shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
8°
0°
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 26. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions are shown in millimeters
ORDERING GUIDE
Model
1
INL (LSB) Temperature Range Package Description Package Option Branding
AD5441BCPZ-R2 ±0.5 −40°C to +125°C 8-Lead LFCSP_WD CP-8-3 DBD
AD5441BCPZ-REEL7 ±0.5 −40°C to +125°C 8-Lead LFCSP_WD CP-8-3 DBD
AD5441BRMZ ±0.5 −40°C to +125°C 8-Lead MSOP RM-8 DBC
AD5441BRMZ-REEL7 ±0.5 −40°C to +125°C 8-Lead MSOP RM-8 DBC
1
Z = RoHS Compliant Part.