Datasheet

Data Sheet AD5412/AD5422
Rev. I | Page 11 of 44
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted. Transient currents of up to
80 mA do not cause SCR latch-up.
Table 5.
Parameter Rating
AV
DD
to GND
−0.3 V to +48 V
AV
SS
to GND +0.3 V to −28 V
AV
DD
to AV
SS
−0.3 V to +60 V
DV
CC
to GND −0.3 V to +7 V
Digital Inputs to GND
−0.3 V to DV
CC
+ 0.3 V or 7 V
(whichever is less)
Digital Outputs to GND
−0.3 V to DV
CC
+ 0.3 V or 7 V
(whichever is less)
REFIN/REFOUT to GND −0.3 V to +7 V
V
OUT
to GND AV
SS
to AV
DD
I
OUT
to GND −0.3 V to AV
DD
Operating Temperature Range (T
A
)
Industrial
1
−40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
J
max) 125°C
24-Lead TSSOP_EP Package
θ
JA
Thermal Impedance
2
35°C/W
40-Lead LFCSP Package
θ
JA
Thermal Impedance
2
33°C/W
Power Dissipation (T
J
max – T
A
)/θ
JA
Lead Temperature JEDEC industry standard
Soldering J-STD-020
ESD (Human Body Model) 2 kV
1
Power dissipated on chip must be derated to keep the junction temperature
below 125°C, assuming that the maximum power dissipation condition is
sourcing 24 mA into GND from I
OUT
with a 4 mA on-chip current.
2
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board with thermal vias. See JEDEC JESD51.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION