Datasheet

Data Sheet AD5421
Rev. G | Page 35 of 36
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
1
0.50
BSC
3.50 REF
BOTT
OM VIEWTOP VIEW
PIN 1
INDICA
T
OR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
3.65
3.50 SQ
3.45
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
04-02-2012-A
Figure 54. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-11)
Dimensions shown in millimeters
COMPLIANT TO JED EC STANDARDS MO-
153-AET
05
-
08
-
20
06
-
A
28
15
14
1
EXPOSED
PAD
(P
ins Up)
9.80
9.7
0
9.
60
4.50
4.40
4.30
6.40
BSC
3
.05
3
.00
2.95
5.55
5.50
5
.45
FOR PROP
ER C
ONNE
CTI
ON O
F
THE EXPO
SED
PAD,
REF
ER T
O
THE PIN
CONF
IGU
RAT
ION
AND
FUNC
TIO
N DE
SCR
IPTI
ONS
SECT
ION
OF TH
IS D
ATA
SHEET.
PIN 1
INDICATOR
BOTTOMVIEW
TOP VIEW
1.2
0 MAX
SEATING
PLAN
E
0.6
5 BS
C
0.30
0.19
0.1
5 MA
X
0.0
5 MI
N
COPLA
NAR
ITY
0.1
0
1.0
5
1.
00
0.
80
0.20
0.09
0.25
8°
0°
0.
75
0
.60
0
.45
Figure 55. 28-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-28-2)
Dimensions shown in millimeters