Datasheet

AD5405
Rev. B | Page 23 of 24
OUTLINE DIMENSIONS
1
40
10
11
31
30
21
20
4.25
4.10 SQ
3.95
TOP
VIEW
6.00
BSC SQ
PIN 1
INDICATOR
5.75
BSC SQ
12° MAX
0.30
0.23
0.18
0.20 REF
SEATING
PLANE
1.00
0.85
0.80
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.80 MAX
0.65 TYP
4.50
REF
0.50
0.40
0.30
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOT TOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
072108-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 45. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Resolution INL (LSB) Temperature Range Package Description Package Option
AD5405YCP 12 ±1 −40°C to +125°C 40-Lead LFCSP_VQ CP-40-1
AD5405YCP–REEL 12 ±1 −40°C to +125°C 40-Lead LFCSP_VQ CP-40-1
AD5405YCP–REEL7 12 ±1 −40°C to +125°C 40-Lead LFCSP_VQ
CP-40-1
AD5405YCPZ 12 ±1 −40°C to +125°C 40-Lead LFCSP_VQ
CP-40-1
AD5405YCPZ–REEL 12 ±1 −40°C to +125°C 40-Lead LFCSP_VQ
CP-40-1
AD5405YCPZ–REEL7 12 ±1 −40°C to +125°C 40-Lead LFCSP_VQ
CP-40-1
EVAL-AD5405EB Evaluation Kit
1
Z = RoHS Compliant Part.