Datasheet

AD5398
Rev. B | Page 15 of 16
OUTLINE DIMENSIONS
SEATING
PLANE
0.50 BSC
BALL PITCH
1.575
1.515
1.455
1.750
1.690
1.630
0.28
0.24
0.20
0.36
0.32
0.28
0.65
0.59
0.53
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
123
B
C
BALL 1
IDENTIFIER
110405-0
Figure 24. 9-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-9)
Dimensions shown in millimeters
1
0.50
BSC
0.60 MAX
PIN 1
INDICATO
R
1.50
REF
0.50
0.40
0.30
2.75
BSC SQ
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90 MAX
0.85 NOM
0.30
0.23
0.18
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.00
BSC SQ
5
8
Figure 25. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD5398BCBZ-REEL7
1
−40°C to +85°C 9-Ball Wafer Level Chip Scale (WLCSP) CB-9
AD5398BCPZ-REEL
1
–40°C to +85°C 8-Lead LFCSP_VD CP-8-2
AD5398BCPZ-REEL7
1
–40°C to +85°C 8-Lead LFCSP_VD CP-8-2
AD5398BCPZ-WP
1
–40°C to +85°C 8-Lead LFCSP_VD CP-8-2
AD5398ZCSURF –40°C to +150°C Die Form
EVAL-AD5398EB Evaluation Board
1
Z = Pb-free part.