Datasheet

AD5398A
Rev. 0 | Page 14 of 16
OUTLINE DIMENSIONS
SEATING
PLANE
0.50 BSC
BALL PITCH
1.575
1.515
1.455
1.750
1.690
1.630
0.28
0.24
0.20
0.35
0.32
0.29
0.65
0.59
0.53
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
123
B
C
BALL 1
IDENTIFIER
091306-B
Figure 23. 9-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-9-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
AD5398ABCBZ-REEL7
1
−30°C to +85°C 9-Ball Wafer Level Chip Scale (WLCSP) CB-9-1 1Z
AD5398ABCBZ-REEL
1
−30°C to +85°C 9-Ball Wafer Level Chip Scale (WLCSP) CB-9-1 1Z
AD5398A-WAFER −40°C to +85°C Bare Die Wafer
EVAL-AD5398AEBZ
1
Evaluation Board
1
Z = RoHS Compliant Part.