Datasheet

AD5390/AD5391/AD5392 Data Sheet
Rev. E | Page 40 of 44
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.25 MIN
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
7.25
7.10 SQ
6.95
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
9.10
9.00 SQ
8.90
8.85
8.75 SQ
8.65
06-13-2012-C
Figure 48. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm x 9 mm Body, Very Thin Quad
(CP-64-3)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BCC
TOP VIEW
(PINS DOWN)
40
52
1
14
13
26
27
39
0.65
BSC
LEAD PITCH
0.38
0.32
0.22
1.60
MAX
0.75
0.60
0.45
VIEW A
PIN 1
0.20
0.09
1.45
1.40
1.35
0.10
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
7°
3.5°
0°
0.15
0.05
12.20
12.00 SQ
11.80
10.20
10.00 SQ
9.80
051706-A
Figure 49. 52-Lead Low Profile Quad Flat Package [LQFP]
(ST-52)
Dimensions shown in millimeters