Datasheet

Data Sheet AD5383
Rev. C | Page 13 of 40
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted
1
.
Table 8.
Parameter Rating
AV
DD
to AGND –0.3 V to +7 V
DV
DD
to DGND –0.3 V to +7 V
Digital Inputs to DGND –0.3 V to DV
DD
+ 0.3 V
SDA/SCL to DGND –0.3 V to +7 V
Digital Outputs to DGND –0.3 V to DV
DD
+ 0.3 V
REFIN/REFOUT to AGND –0.3 V to AV
DD
+ 0.3 V
AGND to DGND –0.3 V to +0.3 V
V
OUT
x to AGND –0.3 V to AV
DD
+ 0.3 V
Analog Inputs to AGND –0.3 V to AV
DD
+ 0.3 V
MON_IN Inputs to AGND –0.3 V to AV
DD
+ 0.3 V
MON_OUT to AGND –0.3 V to AV
DD
+ 0.3 V
ESD
HBM
6.5 kV
FICDM 2 kV
Operating Temperature Range
Commercial (B Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
JunctionTemperature (T
J
Max)
150°C
100-Lead LQFP Package
θ
JA
Thermal Impedance 44°C/W
Reflow Soldering
Peak Temperature 230°C
1
Transient currents of up to 100 mA will not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive
device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although this product features proprietary ESD protection circuitry, permanent damage may
occur on devices subjecte
d to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.