Datasheet

Data Sheet AD5382
Rev. C | Page 13 of 40
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted
1
.
Table 8.
Parameter Rating
AVDD to AGND –0.3 V to +7 V
DVDD to DGND –0.3 V to +7 V
Digital Inputs to DGND –0.3 V to DVDD + 0.3 V
SDA/SCL to DGND –0.3 V to + 7 V
Digital Outputs to DGND –0.3 V to DVDD + 0.3 V
REFIN/REFOUT to AGND –0.3 V to AVDD + 0.3 V
AGND to DGND
–0.3 V to +0.3 V
VOUTx to AGND –0.3 V to AVDD+ 0.3 V
Analog Inputs to AGND –0.3 V to AVDD + 0.3 V
MON_IN Inputs to AGND –0.3 V to AVDD + 0.3 V
MON_OUT to AGND –0.3 V to AVDD + 0.3 V
Operating Temperature Range
Commercial (B Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
JunctionTemperature (T
J
max) 150°C
100-lead LQFP Package
θ
JA
Thermal Impedance 44°C/W
Reflow Soldering
Peak Temperature 230°C
ESD
HBM 6.5 kV
FICDM 2 kV
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION