Datasheet

Data Sheet AD5381
Rev. D | Page 13 of 40
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
1
Table 8.
Parameter Rating
AVDD to AGND –0.3 V to +7 V
DVDD to DGND –0.3 V to +7 V
Digital Inputs to DGND –0.3 V to DVDD + 0.3 V
SDA/SCL to DGND –0.3 V to +7 V
Digital Outputs to DGND –0.3 V to DVDD + 0.3 V
REFIN/REFOUT to AGND –0.3 V to AVDD + 0.3 V
AGND to DGND –0.3 V to +0.3 V
VOUTx to AGND –0.3 V to AVDD + 0.3 V
Analog Inputs to AGND –0.3 V to AVDD + 0.3 V
Operating Temperature Range
Commercial (B Version) –40°C to +85°C
Storage Temperature Range
–65°C to +150°C
JunctionTemperature (T
J MAX
)
150°C
100-Lead LQFP Package
θ
JA
Thermal Impedance 44°C/W
Reflow Soldering
Peak Temperature 230°C
Reflow Soldering (Pb-free)
Peak Temperature 260(0/-5)°C
Time at Peak Temperature 10 sec to 40 sec
ESD
HBM 6.5 kV
FICDM 2 kV
1
Transient currents of up to 100 mA will not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maxi-
mum rating conditions for extended periods may affect device
reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
this product features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.