Datasheet

AD5378
Rev. A | Page 28 of 28
OUTLINE DIMENSIONS
*
COMPLIANT WITH JEDEC STANDARDS MO-192-AAD-1 WITH
THE EXCEPTION OF PACKAGE HEIGHT AND BALL DIAMETER.
B
C
D
E
F
G
H
J
K
L
M
A
SEATING
PLANE
DETAIL A
0.75
0.70
0.65
BALL DIAMETER
0.12 MAX
COPLANARITY
1.00 BSC
*
0.64 TYP
11.00
BSC SQ
12 11
10987654321
1.05
1.00
0.90
A
1 CORNER
INDEX AREA
*
1.8
5
1.70
1.55
TOP VIEW
BOTTOM
VIEW
13.00
BSC SQ
BALL A1
INDICATOR
DETAIL A
012006-0
Figure 23. 108-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-108-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Linearity Error (LSBs) Package Description Package Option
AD5378ABC −40°C to +85°C ±3 108-Ball CSP_BGA BC-108-2
AD5378ABCZ
1
−40°C to +85°C ±3 108-Ball CSP_BGA BC-108-2
1
Z = RoHS Compliant part.
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registered trademarks are the property of their respective owners.
D05292-0-7/09(A)