Datasheet

AD5346/AD5347/AD5348
Rev. 0 | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 4. T
A
= 25°C, unless otherwise noted
Parameter Rating
V
DD
to GND –0.3 V to +7 V
Digital Input Voltage to GND –0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to GND –0.3 V to V
DD
+ 0.3 V
Reference Input Voltage to GND –0.3 V to V
DD
+ 0.3 V
V
OUT
to GND –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) –40°C to +105°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
38-Lead TSSOP Package
Power Dissipation (T
J
max − T
A
)/ θ
JA
mW
θ
JA
Thermal Impedance 98.3°C/W
θ
JC
Thermal Impedance 8.9°C/W
40-Lead LFCSP Package
Power Dissipation (T
J
max − T
A
)/ θ
JA
mW
θ
JA
Thermal Impedance (3-layer
board)
29.6°C/W
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature 220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.