Datasheet

AD5346/AD5347/AD5348
Rev. 0 | Page 23 of 24
OUTLINE DIMENSIONS
38
20
191
9.80
9.70
9.60
PIN 1
SEATING
PLANE
0.15
0.05
0.50
BSC
1.20
MAX
0.27
0.17
0.20
0.09
8°
0°
4.50
4.40
4.30
6.40 BSC
0.70
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153BD-1
COPLANARITY
0.10
Figure 48. 38-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-38)
Dimensions shown in millimeters
1
40
10
11
31
30
21
20
BOTTOM
VIEW
4.25
4.10 SQ
3.95
TOP
VIEW
6.00
BSC SQ
PIN 1
INDICATO
R
5.75
BSC SQ
12° MAX
0.30
0.23
0.18
0.20 REF
SEATING
PLANE
1.00
0.85
0.80
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.80 MAX
0.65 TYP
4.50
REF
0.50
0.40
0.30
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 49. 40-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-40)
Dimensions shown in millimeters