Datasheet

AD532
Rev. D | Page 5 of 16
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 2. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
H-10A 150 25 °C/W
E-20A 85 22 °C/W
D-14 85 22 °C/W
CHIP DIMENSIONS AND BONDING DIAGRAM
Contact factory for latest dimensions.
Dimensions are shown in inches and (mm).
0.062
(1.575)
GND
Z
0.107
(2.718)
–V
S
+V
S
Y
1
Y
2
X
2
X
1
V
OS
OUTPUT
00502-002
Figure 2.
ESD CAUTION