Datasheet

AD532
Rev. D | Page 14 of 16
OUTLINE DIMENSIONS
C
ONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FO
R
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
.
14
1
7
8
0.310 (7.87)
0.220 (5.59)
PIN 1
0.080 (2.03) MAX
0.005 (0.13) MIN
SEATING
PLANE
0.023 (0.58)
0.014 (0.36)
0.060 (1.52)
0.015 (0.38)
0.200 (5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.070 (1.78)
0.030 (0.76)
0.100 (2.54)
BSC
0.150
(3.81)
MIN
0.765 (19.43) MAX
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
Figure 20. 14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
(D-14)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
1
20
4
9
8
13
19
14
3
18
BOTTOM
VIEW
0.028 (0.71)
0.022 (0.56)
45° TYP
0.015 (0.38)
MIN
0.055 (1.40)
0.045 (1.14)
0.050 (1.27)
BSC
0.075 (1.91)
REF
0.011 (0.28)
0.007 (0.18)
R TYP
0.095 (2.41)
0.075 (1.90)
0.100 (2.54) REF
0.200 (5.08)
REF
0.150 (3.81)
BSC
0.075 (1.91)
REF
0.358 (9.09)
0.342 (8.69)
SQ
0.358
(9.09)
MAX
SQ
0.100 (2.54)
0.064 (1.63)
0.088 (2.24)
0.054 (1.37)
022106-A
Figure 21. 20-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-20-1)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
DIMENSIONS PER JEDEC STANDARDS MO-006-AF
0.500 (12.70)
MIN
0.185 (4.70)
0.165 (4.19)
REFERENCE PLANE
0.050 (1.27) MAX
0.040 (1.02) MAX
0.335 (8.51) 0.305 (7.75)
0.370 (9.40) 0.335 (8.51)
0.021 (0.53)
0.016 (0.40)
1
0.034 (0.86)
0.025 (0.64)
0.045 (1.14)
0.025 (0.65)
0.160 (4.06)
0.110 (2.79)
6
2
8
7
5
4
3
0.115
(2.92)
BSC
9
10
0.230 (5.84)
BSC
BASE & SEATING PLANE
36° BSC
022306-A
Figure 22. 10-Pin Metal Header Package [TO-100]
(H-10)
Dimensions shown in inches and (millimeters)