Datasheet

Data Sheet AD5293
Rev. E | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 6.
Parameter Rating
V
DD
to GND −0.3 V to +35 V
V
SS
to GND +0.3 V to −25 V
V
LOGIC
to GND −0.3 V to +7 V
V
DD
to V
SS
35 V
V
A
, V
B
, V
W
to GND V
SS
− 0.3 V, V
DD
+ 0.3 V
Digital Input and Output Voltage to GND −0.3 V to V
LOGIC
+0.3 V
EXT_CAP Voltage to GND −0.3 V to +7 V
I
A
, I
B
, I
W
Continuous
R
AB
= 20 kΩ ±3 mA
R
AB
= 50 kΩ, 100 kΩ ±2 mA
Pulsed
1
Frequency > 10 kHz
MCC
2
/d
3
Frequency ≤ 10 kHz MCC
2
/√d
3
Operating Temperature Range −40°C to +105°C
Maximum Junction Temperature (T
J
max) 150°C
Storage Temperature Range −65°C to +150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 20 sec to 40 sec
Package Power Dissipation (T
J
max − T
A
)/θ
JA
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2
Maximum continuous current.
3
Pulse duty factor.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
14-Lead TSSOP 93
1
20 °C/W
1
JEDEC 2S2P test board, still air (from 0 m/sec to 1 m/sec of air flow).
ESD CAUTION
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