Datasheet

AD5291/AD5292
Rev. D | Page 10 of 32
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 8.
Parameter Rating
V
DD
to GND −0.3 V to +35 V
V
SS
to GND +0.3 V to − 25 V
V
LOGIC
to GND −0.3 V to + 7 V
V
DD
to V
SS
35 V
V
A
, V
B
, V
W
to GND V
SS
− 0.3 V, V
DD
+ 0.3 V
Digital Input and Output Voltage to GND −0.3 V to V
LOGIC
+ 0.3 V
EXT_CAP Voltage to GND −0.3 V to +7 V
I
A
, I
B
, I
W
Continuous
R
AB
= 20 kΩ ±3 mA
R
AB
= 50 kΩ, 100 kΩ ±2mA
Pulsed
1
Frequency > 10 kHz MCC
2
/d
3
Frequency ≤ 10 kHz MCC
2
/√d
3
Operating Temperature Range
4
−40°C to +105°C
Maximum Junction Temperature (T
J
max) 150°C
Storage Temperature Range −65°C to +150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 20 sec to 40 sec
Package Power Dissipation (T
J
max − T
A
)/θ
JA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is defined by JEDEC specification JESD-51 and the value is
dependent on the test board and test environment.
Table 9. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
14-Lead TSSOP 93
1
20 °C/W
1
JEDEC 2S2P test board, still air (0 m/sec to 1 m/sec air flow).
ESD CAUTION
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2
Maximum continuous current
3
Pulse duty factor.
4
Includes programming of OTP memory.