Datasheet

Data Sheet AD5272/AD5274
Rev. D | Page 9 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 8.
Parameter Rating
V
DD
to GND –0.3 V to +7.0 V
V
SS
to GND +0.3 V to −7.0 V
V
DD
to V
SS
7 V
V
A
, V
W
to GND V
SS
− 0.3 V, V
DD
+ 0.3 V
Digital Input and Output Voltage to GND −0.3 V to V
DD
+ 0.3 V
EXT_CAP to V
SS
7 V
I
A
, I
W
Continuous
R
AW
= 20 kΩ ±3 mA
R
AW
= 50 kΩ, 100 kΩ ±2 mA
Pulsed
1
Frequency > 10 kHz ±MCC
2
/d
3
Frequency ≤ 10 kHz ±MCC
2
/√d
3
Operating Temperature Range
4
−40°C to +125°C
Maximum Junction Temperature
(T
J
Maximum)
150°C
Storage Temperature Range −65°C to +150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 20 sec to 40 sec
Package Power Dissipation (T
J
max − T
A
)/θ
JA
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A and W terminals at a given
resistance.
2
Maximum continuous current
3
Pulse duty factor.
4
Includes programming of 50-TP memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is defined by JEDEC specification JESD-51 and the value is
dependent on the test board and test environment.
Table 9. Thermal Resistance
Package Type θ
JA
1
θ
JC
Unit
10-Lead LFCSP 50 3 °C/W
10-Lead MSOP 135 N/A °C/W
1
JEDEC 2S2P test board, still air (0 m/s air flow).
ESD CAUTION