Datasheet

Table Of Contents
AD5263 Data Sheet
Rev. F | Page 28 of 28
OUTLINE DIMENSIONS
24
13
121
6.40 BSC
4.50
4.40
4.30
PIN 1
7.90
7.80
7.70
0.15
0.05
0.30
0.19
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
SEATING
PLANE
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AD
Figure 72. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Notes R
AB
(kΩ) Temperature Package Description Package Option Ordering Quantity
AD5263BRU20 20 −40°C to +125°C 24-Lead TSSOP RU-24 62
AD5263BRUZ20
3
20 −40°C to +125°C 24-Lead TSSOP RU-24 62
AD5263BRUZ20-REEL7
3
20 −40°C to +125°C 24-Lead TSSOP RU-24 1,000
AD5263BRU50 50 −40°C to +125°C 24-Lead TSSOP RU-24 62
AD5263BRU50-REEL7 50 −40°C to +125°C 24-Lead TSSOP RU-24 1,000
AD5263BRUZ50
3
50 −40°C to +125°C 24-Lead TSSOP RU-24 62
AD5263BRUZ50-REEL7
3
50 −40°C to +125°C 24-Lead TSSOP RU-24 1,000
AD5263BRU200
200
−40°C to +125°C
24-Lead TSSOP
RU-24
62
AD5263BRUZ200
3
200 −40°C to +125°C 24-Lead TSSOP RU-24 62
AD5263BRUZ200-R7
3
200 −40°C to +125°C 24-Lead TSSOP RU-24 1,000
EVAL-AD5263EBZ
4
Evaluation Board
1
The AD5263 contains 5,184 transistors. Die size: 108 mil × 198 mil = 21,384 sq. mil.
2
Package branding: Line 1 contains the model number, Line 2 contains the end-to-end resistance, and Line 3 contains the date code YYWW.
3
Z = RoHS Compliant Part.
4
The evaluation board is shipped with the 20 kΩ R
AB
resistor option; however, the board is compatible with all available resistor value options.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©20032012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03142-0-10/12(F)