Datasheet

AD5263
Rev. 0 | Page 26 of 28
OUTLINE DIMENSIONS
24
13
121
6.40 BSC
4.50
4.40
4.30
PIN 1
7.90
7.80
7.70
0.15
0.05
0.30
0.19
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-153AD
0.10 COPLANARITY
Figure 72. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
ORDERING GUIDE
Table 12. Ordering Guide
Model
1
R
AB
(kΩ) Temperature Package Description Package Option Parts per Container
AD5263BRU20 20 –40°C to +125°C TSSOP-24 RU-24 62
AD5263BRU20-REEL7 20 –40°C to +125°C TSSOP-24 RU-24 1,000
AD5263BRU50 50 –40°C to +125°C TSSOP-24 RU-24 62
AD5263BRU50-REEL7 50 –40°C to +125°C TSSOP-24 RU-24 1,000
AD5263BRU200 200 –40°C to +125°C TSSOP-24 RU-24 62
AD5263BRU200-REEL7 200 –40°C to +125°C TSSOP-24 RU-24 1,000
AD5263EVAL See Note 2 Evaluation Board
1
Package branding: Line 1 contains the model number, Line 2 contains the end-to-end resistance, and Line 3 contains the date code YYWW.
2
The evaluation board is shipped with the 20 kΩ R
AB
resistor option; however, the board is compatible with all available resistor value options.
The AD5263 contains 5,184 transistors. Die size: 108 mil × 198 mil = 21,384 sq. mil.