Datasheet

Data Sheet AD5232
Rev. C | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to GND −0.3 V, +7 V
V
SS
to GND +0.3 V, −7 V
V
DD
to V
SS
7 V
V
A
, V
B
, V
W
to GND V
SS
− 0.3 V, V
DD
+ 0.3 V
A
X
− B
X
, A
X
− W
X
, B
X
− W
X
Intermittent
1
±20 mA
Continuous
±2 mA
Digital Inputs and Output Voltage to GND −0.3 V, V
DD
+ 0.3 V
Operating Temperature Range
2
−40°C to +85°C
Maximum Junction Temperature (T
J
max) 150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Package Power Dissipation (T
J
max − T
A
)/θ
JA
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2
Includes programming of nonvolatile memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
16-Lead TSSOP (RU-16) 150 28 °C/W
ESD CAUTION