Datasheet

Data Sheet AD5231
Rev. D | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameters Ratings
V
DD
to GND –0.3 V, +7 V
V
SS
to GND +0.3 V, −7 V
V
DD
to V
SS
7 V
V
A
, V
B
, V
W
to GND V
SS
− 0.3 V, V
DD
+ 0.3 V
A–B, A–W, B–W
Intermittent
1
±20 mA
Continuous ±2 mA
Digital Input and Output Voltage
to GND
−0.3 V, V
DD
+ 0.3 V
Operating Temperature Range
2
−40°C to +85°C
Maximum Junction Temperature
(T
J
max)
150°C
Storage Temperature −65°C to +150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 20 sec to 40 sec
Thermal Resistance
Junction-to-Ambient (θ
JA
),TSSOP-16
150°C/W
Junction-to-Case (θ
JC
), TSSOP-16 28°C/W
Package Power Dissipation (T
J
max − T
A
)/θ
JA
1
Maximum terminal current is bounded by the maximum current handling of the
switches, maximum power dissipation of the package, and maximum applied
voltage across any two of the A, B, and W terminals at a given resistance.
2
Includes programming of nonvolatile memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION