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Datasheet

ManualsBrandsANALOG DEVICES ManualsData collecting ICsData acquisition IC - Digital potentiometer linear Non-permanent TSSOP 24
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AD5204/AD5206
Rev. C | Page 18 of 20
24
13
121
6.40 BSC
4.50
4.40
4.30
PIN 1
7.90
7.80
7.70
0.15
0.05
0.30
0.19
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AD
Figure 37. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.45
3.30 SQ
3.15
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
112408-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
kΩ Temperature Range Package Description Package Option
AD5204BN10 10 −40°C to +85°C 24-Lead Plastic Dual In-Line Package [PDIP] N-24-1
AD5204BR10 10 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD5204BR10-REEL 10 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD5204BRZ10 10 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD5204BRZ10-REEL 10 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD5204BRU10 10 −40°C to +85°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
AD5204BRU10-REEL7 10 −40°C to +85°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
AD5204BRUZ10 10 −40°C to +85°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
AD5204BRUZ10-REEL7 10 −40°C to +85°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
AD5204BCPZ10-REEL 10 −40°C to +85°C 32-Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-3
AD5204BCPZ10-REEL7 10 −40°C to +85°C 32-Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-3
AD5204BN50 50 −40°C to +85°C 24-Lead Plastic Dual In-Line Package [PDIP] N-24-1
AD5204BR50 50 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD5204BR50-REEL 50 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD5204BRZ50 50 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24