Datasheet

AD5174
Rev. B | Page 18 of 20
OUTLINE DIMENSIONS
2.48
2.38
2.23
0.50
0.40
0.30
121009-A
TOP VIEW
10
1
6
5
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.74
1.64
1.49
0.20 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 30. 10-Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3mm Body, Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-BA
091709-A
6°
0°
0.70
0.55
0.40
5
10
1
6
0.50 BSC
0.30
0.15
1.10 MAX
3.10
3.00
2.90
COPLANARITY
0.10
0.23
0.13
3.10
3.00
2.90
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 31. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
R
AB
(kΩ) Resolution Temperature Range Package Description Package Option Branding
AD5174BRMZ-10 10 1,024 −40°C to +125°C 10-Lead MSOP RM-10 DDT
AD5174BRMZ-10-RL7 10 1,024 −40°C to +125°C 10-Lead MSOP RM-10 DDT
AD5174BCPZ-10-RL7 10 1,024 −40°C to +125°C 10-Lead LFCSP_WD CP-10-9 DEF
1
Z = RoHS Compliant Part.