Datasheet
AD22100
REV. B
–3–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +10 V
Reversed Continuous Supply Voltage . . . . . . . . . . . . . . –10 V
Operating Temperature . . . . . . . . . . . . . . . . –50°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +160°C
Output Short Circuit to V+ or Ground . . . . . . . . . . Indefinite
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C
1
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only; the functional
operation of the device at these or any other conditions above those indicated in the
operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
Guaranteed
Temperature Package Package
Model/Grade Range Description* Option
AD22100 KT 0°C to 100°C TO-92 TO-92
AD22100 KR 0°C to 100°C SOIC SO-8
AD22100 AT –40°C to +85°C TO-92 TO-92
AD22100 AR –40°C to +85°C SOIC SO-8
AD22100 ST –50°C to +150°C TO-92 TO-92
AD22100 SR –50°C to +150°C SOIC SO-8
AD22100KChips +25°C N/A N/A
*Minimum purchase quantities of 100 pieces for all chip orders.
PIN DESCRIPTION
Mnemonic Function
V+ Power Supply Input
V
O
Device Output
GND Ground Pin must be connected to 0 V.
NC No Connect
PIN CONFIGURATIONS
TO-92
PIN 3
PIN 2 PIN 1
GND V
O
V+
BOTTOM VIEW
(Not to Scale)
SOIC
1
2
3
4
8
7
6
5
TOP VIEW
(Not to Scale)
AD22100
NC
NC
NC
NC
V+
NC
GND
V
O
NC = NO CONNECT
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD22100 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Typical Performance Curves
50
12000
100
150
200
800400
FLOW RATE – CFM
θ
JA
– °C/W
(SOIC)
250
(T0-92)
Figure 3. Thermal Resistance vs. Flow Rate
Figure 2. Thermal Response vs. Flow Rate
2
1200
4
0
8
6
10
12
14
800400
T (T0-92)
FLOW RATE – CFM
T (SOIC)
16
τ
– Sec