Datasheet

AD1852
Rev. A | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter Rating
DVDD to DGND −0.3 V to +6 V
AVDD to AGND −0.3 V to +6 V
Digital Inputs DGND − 0.3 V to DVDD + 0.3 V
Analog Outputs AGND − 0.3 V to AVDD + 0.3 V (see Figure 26)
AGND to DGND −0.3 V to +0.3 V
Reference Voltage (AVDD + 0.3 V)/2 V
Soldering 300°C
10 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 10.
Package Type θ
JA
θ
JC
Unit
Thermal Resistance
Junction-to-Ambient 109 °C/W
Junction-to-Case 39 °C/W
ESD CAUTION