Datasheet

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www.ams.com/AS5030 Revision 2.4 5 - 44
AS5030
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol Parameter Min Max Units Comments
Electrical Parameters
V
DD Supply voltage -0.3 7 V Except during OTP programming
V
IN Input pin voltage VSS - 0.5 VDD + 0.5 V
I
scr
Input current (latch-up immunity) -100 100 mA Norm: Jedec 78
Electrostatic Discharge
ESD Electrostatic Discharge ±2 kV Norm: MIL 883 E method 3015
Θ
JA
Package thermal resistance
137 °C/W Still Air / Single Layer PCB
89 °C/W Still Air / Multilayer PCB
Temperature Ranges and Storage Conditions
T
strg
Storage temperature -55 +150 °C Min -67ºF; Max +257ºF
TBODY Body temperature 260 °C
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification
for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
Humidity non-condensing 5 85 %
MSL Moisture Sensitive Level 3 Represents a maximum floor time of 168h