Datasheet

Table Of Contents
www.ams.com/AS5030 Revision 2.4 42 - 44
AS5030
Datasheet - Package Drawings and Markings
JEDEC Package Outline Standard: MO - 153 AB
Thermal Resistance R
th(j-a)
: 89 K/W in still air, soldered on PCB
9.1 Recommended PCB Footprint
Figure 38. PCB Footprint
Recommended Footprint Data
Symbol mm inch
A7.260.286
B4.930.194
C0.360.014
D0.650.0256
E4.910.193