User`s manual

DIGITAL-LOGIC AG MSLB-P5 Manual V0.3
PRELIMINARY 30
4. VERTICAL CLEARANCE ZONES
The EBX form-factor is subdivided into zones which are intended for various interfaces and
components. Each of these zones, and their associated functions, are defined in Figures 2 and 3
(Appendix A) and are described below. Each zone has a specified vertical dimension within
which all components of that zone must fit. Table 2 specifies the maximum component height
within each EBX zone.
Figure 2 or 3 will apply, depending on whether the Tall CPU or PC Card option is desired. Many
EBX compliant boards have single board computer functions. including memory expansion, PC
Card slots, Ethernet ports, mass storage and auxiliary ports, and CRT and LCD interfaces. EBX
does not require all these functions, nor does it specify that they must appear in a particular
location. However, observing these guidelines facilitates interoperability among multiple EBX
form-factor products, such as compatibility with multivendor packaging.
Table 2. EBX Vertical Clearance Zones
Zone Description Max. Component Height (in.)
A Memory expansion 1.5
B Power connector 0.5
C Video I/O (option)(includes mating connectors) 0.75
D Misc. primary side components 0.75
E General purpose I/O, tall region
(includes mating connectors) 0.75
F PC/104- Plus stack location
(Primary and secondary side) See PC/104- Plus spec
G PC/104- Plus module I/O areas 0.6
H Tall CPU (option) (includes heat sink) 1.2
I PC Card slot (option) 0.6
J General purpose I/O, low profile region
(includes mating connectors) 0.5
--- Secondary side components 0.19
--- Board thickness 0.062