Data Sheet
www.ampedrftech.com
3
Table of Contents
1.
Hardware Specifications ........................................................................................................ 4
1.1.
Recommended Operating Conditions ...................................................................................................................... 4
1.2.
Absolute Maximum Ratings ..................................................................................................................................... 4
1.3.
Current Consumption ............................................................................................................................................... 4
1.4.
Selected RF Characteristics .................................................................................................................................... 5
1.5.
I/O Operating Characteristics ................................................................................................................................... 5
1.6.
Pin Assignment ........................................................................................................................................................ 6
1.7.
Pin Placement Diagram (Top View) ......................................................................................................................... 7
1.8.
Layout Drawing ........................................................................................................................................................ 8
2.
Module Block Diagram ........................................................................................................... 9
3.
Hardware Design ..................................................................................................................... 9
3.1.
Module Reflow Installation ..................................................................................................................................... 10
3.2.
GPIO Interface ....................................................................................................................................................... 10
3.3.
PCB Layout Guidelines .......................................................................................................................................... 11
3.4.
External LPO Input Circuit ..................................................................................................................................... 11
3.5.
Application Reference Design................................................................................................................................ 13
4.
Regulatory Compliance ........................................................................................................ 14
4.1.
Modular Approval, FCC and IC .............................................................................................................................. 15
4.2.
FCC Label Instructions .......................................................................................................................................... 15
4.3.
CE Label Instructions ............................................................................................................................................. 16
5.
Ordering Information ............................................................................................................ 16
6.
Revision History .................................................................................................................... 16