User's Manual

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3 Hardware Design
3.1 Block Diagram
3.2 Layout
 All unused pins should be left floating; do not ground.
 All GND pins must be well grounded.
 The area around the antenna should be free of any ground planes, power planes, trace
routings, or metal for at least 6.5 mm in all directions.
 Traces should not be routed underneath the module.
3.3 Module Reflow
The WF43 is a surface mount module supplied on a 15 pin, 6-layer PCB. The final assembly
recommended reflow profiles are:
For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.
 Maximum peak temperature of 230° - 240°C (below 250°C).
 Maximum rise and fall slope after liquidous of < 2°C/second.
 Maximum rise and fall slope after liquidous of < 3°C/second.
 Maximum time at liquidous of 40 – 80 seconds.
3.4 GPIO Interface
All GPIOs are capable of sinking and sourcing 4mA of I/O current.