User's Manual

Ph
o
Ad
d
电
话
地
址
3
4
o
ne: [phone]
5
d
ress : 1879 Lund
y
话
：[phone]
址
：天津市华苑
产
Module
B
Hardwa
r
A
mp’ed R
F
usage of
t
beyond th
e
Notes

A
n
e

A
ll u

A
ll
G
 The
routi
 Trac
4.1 Mod
u
The BT53
assembly
r
For RoHS
/
 Max
i
 Max
i
 Max
i
 Max
i
5
30 | Fax: 408-21
3
y
Ave, ste. 138, Sa
n
5100 | 传真：+8
6
产
业区海泰西路 1
8
B
lock Dia
g
r
e Design
F
modules s
u
t
hese interfa
e
scope of th
e
xternal Low
nused pins
s
G
ND pins mu
area aroun
d
ngs, or met
a
es should n
o
u
le Reflow I
n
is a surfa
c
r
ecommend
e
/
Pb-free app
l
i
mum peak t
i
mum rise a
n
i
mum rise a
n
i
mum time a
t
3
-9533 | E-mail: i
n
n
Jose, CA 95131
6
022-83945100
转
8
号西 3B-202（
3
g
ram
u
pport UAR
T
ces is depe
is documen
t
Power Oscil
s
hould be le
ft
st be well gr
d
the ante
n
a
l for at least
o
t be routed
n
stallation
c
e mount B
l
e
d reflow pr
o
l
ications, Sn
9
emperature
n
d fall slope
a
n
d fall slope
a
t
liquidous o
f
n
fo@ampedrftech.
c
转
111 | E-mail: inf
o
3
00384）
T
, USB, SPI
,
ndent upon
t
. The AT co
m
lator is requ
i
ft
floating; d
o
ounded.
n
na should
b
6 mm in all
d
underneath
t
l
uetooth mo
o
files are:
9
6.5/Ag3.0/
C
of 230° - 24
0
a
fter liquido
u
a
fter liquido
u
f
40 – 80 se
c
c
om
o
cn@ampedrftech
,
and GPIO
the firmwar
m
mand inte
r
i
red on pin 1
o
not ground.
b
e free of
a
d
irections.
t
he module.
dule suppli
e
C
u0.5 solder
0
°C (below
2
u
s of < 2°C/
s
u
s of < 3°C/
s
c
onds.
.com
hardware in
t
e that is lo
a
r
face uses th
5.
a
ny ground
e
d on a 18
is recomme
2
50°C).
s
econd.
s
econd.
t
erfaces. Pl
e
a
ded into th
e
e main UA
R
planes, po
w
pin, 6-laye
r
nded.
e
ase note th
a
e
module, a
R
T by default
w
er planes,
r
PCB. The
a
t the
nd is
.
trace
final
9