User's Manual

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Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131
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地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）
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Table of Contents
BT53 Product Specification ................................................................................................................................................ 2
Description ......................................................................................................................................................................... 2
1 Software Architecture ................................................................................................................................................. 4
1.1 Lower Layer Stack ..................................................................................................................................................... 4
1.2 Upper Layer Stack: Amp’ed UP ................................................................................................................................. 4
1.3 HCI Interface .............................................................................................................................................................. 4
1.4 AT Command Set: abSerial ....................................................................................................................................... 4
2 Hardware Specifications ............................................................................................................................................ 5
2.1 Recommended Operating Conditions ........................................................................................................................ 5
2.2 Absolute Maximum Ratings ....................................................................................................................................... 5
2.3 Current Consumption ................................................................................................................................................. 5
2.4 Selected RF Characteristics....................................................................................................................................... 6
2.5 I/O Operating Characteristics ..................................................................................................................................... 6
2.6 Pin Assignment .......................................................................................................................................................... 7
2.7 Pin Placement Diagram (Top View) ........................................................................................................................... 8
2.8 Layout Drawing .......................................................................................................................................................... 8
3 Module Block Diagram ............................................................................................................................................... 9
4 Hardware Design ....................................................................................................................................................... 9
4.1 Module Reflow Installation ......................................................................................................................................... 9
4.2 GPIO Interface ......................................................................................................................................................... 10
4.3 UART Interface ........................................................................................................................................................ 10
4.4 PCB Layout Guidelines ............................................................................................................................................ 11
4.5 Reset Circuit ............................................................................................................................................................. 11
4.6 External LPO Input Circuit........................................................................................................................................ 12
4.7 Audio Application Reference Design ....................................................................................................................... 13
5 Regulatory Compliance ............................................................................................................................................ 13
5.1 Modular Approval, FCC and IC ................................................................................................................................ 14
5.2 FCC Label Instructions ............................................................................................................................................. 14
6 Ordering Information ................................................................................................................................................ 15
7 Feature Comparison ................................................................................................................................................ 15
8 Revision History ....................................................................................................................................................... 15