User Manual

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3 Module Block Diagram
4 Hardware Design
Amp’ed RF modules support UART, I2C, SPI, and GPIO hardware interfaces. Please note that the
usage of these interfaces is dependent upon the firmware that is loaded into the module, and is
beyond the scope of this document. The AT command interface uses the main UART by default.
Notes
 All unused pins should be left floating; do not ground.
 All GND pins must be well grounded.
 The area around the antenna should be free of any ground planes, power planes, trace
routings, or metal for at least 6 mm in all directions.
 Traces should not be routed underneath the module.
4.1 Module Reflow Installation
The BT24 is a surface mount Bluetooth module supplied on a 22 pin, 4-layer PCB. The final
assembly recommended reflow profiles are:
For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.
 Maximum peak temperature of 230° - 240°C (below 250°C).
 Maximum rise and fall slope after liquidous of < 2°C /second.
 Maximum rise and fall slope after liquidous of < 3°C /second.
 Maximum time at liquidous of 40 – 80 seconds.