User Manual

Amp’ed RF Technology, Inc.
Rev: 1.0 4/20/2012
BT33 Bluetooth Module OEM General User and
Installation Guide
I. OEM Usage Instructions
Installation
The BT33 is a surface mount Bluetooth module supplied on a 24 pin, 6-layer
PCB. The final assembly recommended reflow profiles are:
For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.
§ Maximum peak temperature of 230° - 240°C (below 250°C).
§ Maximum rise and fall slope after liquidous of < 2°C/second.
§ Maximum rise and fall slope after liquidous of < 3°C/second.
§ Maximum time at liquidous of 40 – 80 seconds.
Layout
The area around the BT33 module should be free of any ground planes, trace
routings, or metal for at least 6mm from the antenna in all directions. Traces should
not be routed underneath the module.
Crystal Tuning and Power Calibration
These steps are performed by the manufacturer, and must NOT be modified from
the settings applied during manufacturing. Any changes to these settings may void
the user’s authority to operate this equipment.
Operating Conditions
The permitted operating and storage temperatures, power supply requirements, and
I/O tolerances are specified in the BT33 Datasheet.
RF Exposure Warning
This equipment complies with FCC and IC radiation exposure limits set forth for an
uncontrolled environment. This device must be installed in accordance with provided
instructions and it must be operated with a minimum of 20 cm spacing between
antennas and all persons’ bodies (excluding extremities of hands, wrists and feet)
during wireless mode of operation. Further, this transmitter must not be co-located or
operated in conjunction with any other antenna or transmitter.

Summary of content (4 pages)