User`s guide

4 KTC5520/EATX
www.kontron.com
1.4 Virtualization Capabilities
• Intel® Virtualization Technology in Intel® Xeon® processors (Intel® VT-x)
• Intel® Virtualization Technology for Directed I/O (Intel® VT-d)
• Intel® Virtualization Technology for Connectivity (Intel® VT-c)
Management Features
•IPMI v2.0
• Extensive sensors monitoring and event generation on thresholds
• Remote management using web management interface
• Built-in KVM/VM over IP (BMC)
• IPMI Over LAN/ Serial over LAN (IOL/SOL)
Form Factor • Server System Infrastructure (SSI) :EEB Form factor
Dimensions • EATX (Extended ATX) 12 inches (304.8 mm) x 13 inches (330.2 mm)
Environmental • Designed for FCC A Certification with 6 dB margin
Thermal
• 0 -50 C* with sufficient airflow
*Temperature might be higher depending on the chassis. A validation is required.
Humidity • Designed to meet 5% to 95% non-condensing
Power
Max consumption :
• Setting: Intel® Xeon® Processor E5540 (80W), 48GB DDR3 memory, SATA HDD
• Total: 310W
• Setting: Intel® Xeon® Processor L5518 (60W), 48GB DDR3 memory, SATA HDD
• Total: 270W
• Setting: Intel® Xeon® Processor W5580 (130W), 48GB DDR3 memory, SATA HDD
• Total: 435W
Power supply must be compliant to the SSI specification
Software Support • Windows Server 2008 and Red Hat Enterprise Linux version 5.2 or later (64 bits)
Compliance
• PCIe 2.0 specification
• 6 out of 6 to the RoHS/ WEEE European Directives, China RoHS requirements
• ACPI rev 2.0
•HPM.1
• IPMI 2.0
• SSI : Enterprise Electronics Bay Specification 2008, Version 1.
Target Certifications
• Designed to meet UL 60950-1 safety certification, EN55022 Class A, ETS-300-019 compliance,
EN-300-386, IEC 60950, CSA C22.2/60950 (Canada), EN 60950 (EU), EN 55024 (EU), EMC
Directive 89/336/EEC (EU), CE, NEBS Level 3 (designed for), FCC B
Features Description