Specification Sheet

PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
87AMD Sempron™ Processor
4.3.1 SD mmmm HB pnc GM (45 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 88.
State Specification Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.175 V
VID_VDDNB Max 11,7 N/A 1.175 V
IDDNB Max 12 N/A 4.4 A
CPU COF 6
TDP 3,7 42.0 W 41.0 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.350 V 1.350 V
IDD Max 3,10 30.1 A 26.7 A
CPU COF 6
TDP 3,7 36.9 W 30.3 W
VID_VDD Min 9 1.050 V 1.000 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 27.6 A 18.7 A
CPU COF 6
TDP 3,7 35.5 W 23.9 W
VID_VDD Min 9 1.050 V 0.900 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 26.4 A 13.6 A
CPU COF 6
TDP 3,7 32.7 W 19.4 W
VID_VDD Min 9 1.050 V 0.825 V
VID_VDD Max 9 1.075 V 1.075 V
IDD Max 3,10 23.9 A 9.5 A
Core Power (Pre-Flush) 20 15.9 W 4.1 W
Core Power (Post-Flush) 20 14.1 W 2.9 W
NB Power 17 N/A 2.2 W
I/O Power 13 6.5 W 6.5 W
S0.C1E.Pmin
TDP 16 9.8 W 4.9 W
S3
I/O Power 13 350 mW 350 mW
S0.C0.P3
2800 MHz
S0.Cx.Px
OPN SDX145HBK13GM
19
S0.C0.Px
55
o
C to 63
o
C
70
o
C
5
o
C
R
S0.C0.P3
S0.C0.P2
1600 MHz
S0.C0.P3
800 MHz
S0.C0.P1
2000 MHz
S0.C0.P0
S0.C1.Pmin