Specification Sheet

PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
84AMD Sempron™ Processor
Table 23. AMD Sempron™ Processor Thermal Profiles
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.AMD Athlon™ Processor Thermal Profiles
Thermal Profile R
Heat S ink Class
HS55
Heat S ink Thermal
Resistance
0.51°C/W
Heat S ink Local
Ambi e nt
42°C
Profile Thermal
Resistance
0.366°C/W
Profile Ambient
48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.3°C
25.0 W 57.2°C
30.0 W 59.0°C
35.0 W 60.8°C
41.0 W 63.0°C